Rugged Thermal Solutions for High Power Embedded Electronics

Military electronics have some of the most stringent requirements when you combine the total power of the devices and the environment they will experience over the course of missions. Unlike most other high-power computing applications, military electronics need to withstand shock, vibration, humidity, salt, fog, dust debris and extremely high temperature environments. Coupling these thermal and mechanical (must-have) requirements with the ongoing SWaP goals of military systems makes it extremely challenging for design engineers to properly develop a thermal solution, predict performance and sustain cost effective manufacturing. 

This eBook covers:

  • Thermal management issues often found in embedded computing applications
  • Conduction Cooling, Air Cooling and Liquid Cooling applications
  • Case studies that apply directly to issues seen in high power embedded electronics

 

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